Bhubaneswar, April 18: In a landmark step towards positioning Odisha as a global hub for advanced semiconductor manufacturing, the State is set to host the groundbreaking ceremony of Heterogenous Integration Packaging Solutions (3D Glass Solutions), India’s first Advanced Glass Semiconductor Packaging Unit on Sunday (April 19) in Bhubaneswar.

The ceremony will be graced by Chief Minister Mohan Charan Majhi, in the presence of Union Minister for Electronics & IT, Ashwini Vaishnaw, and Odisha Electronics & IT Minister Dr Mukesh Mahaling, Minister. The event will also witness participation from senior Government officials, global industry leaders, investors, and academia.

This pioneering project marks the arrival of the world’s most advanced chip packaging technology in India, firmly placing Odisha at the forefront of next-generation semiconductor innovation.

To be developed at a cost of around Rs 1,943 crore, the project is expected to create 2,500 direct and indirect job opportunites. Annual production capacity of 50 million assembled units has been estimated from the preoject.

Chips to serve key sectors including aerospace, defence, artificial intelligence, 5G technologies and Data Centres will be developed at the unit.

This milestone further strengthens Odisha’s semiconductor ecosystem, making it the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on Glass Substrates.

The initiative underscores the Government of Odisha’s commitment to fostering high-tech industries, attracting global investments, and creating a robust innovation-driven economy aligned with the vision of Atmanirbhar Bharat.