Odisha breaks ground on India’s First Advanced 3D Chip Packaging Unit

Bhubaneswar, April 19: Odisha took a major leap into the global semiconductor value chain on Sunday with Chief Minister...

Odisha CM to perform ground breaking ceremony for India’s First Advanced 3D Chip Packaging Unit in Bhubaneswar tomorrow

Bhubaneswar, April 18: In a landmark step towards positioning Odisha as a global hub for advanced semiconductor manufact...