Bhubaneswar, April 19: Odisha took a major leap into the global semiconductor value chain on Sunday with Chief Minister Mohan Charan Majhi and Union Electronics and IT Minister Ashwini Vaishnaw performing the groundbreaking for 3D Glass Solutions Inc.'s (3DGS) advanced chip packaging unit in Info Valley, Bhubaneswar. The facility is set to bring "world's most advanced technology" to Odisha, positioning the state in the "top-tier of chip packaging."
3DGS will set up a vertically integrated advanced packaging and embedded glass substrate unit that will bring "the world's most advanced packaging technology to India." The plant will host a wide range of next-generation technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules.
Planned capacity is approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. The products will have "significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics."
The Centre had approved semiconductor manufacturing units in Odisha in 2025, including projects by SiCSem Private Limited and 3D Glass Solutions Inc. (3DGS). SiCSem, in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish India's first commercial compound semiconductor fabrication unit in Info Valley, Bhubaneswar.
"Today marks a landmark moment as we break ground on India's first Advanced 3D Glass Chip Packaging Unit. This visionary project will unlock significant employment opportunities and firmly establish Odisha as a serious force in advanced electronics manufacturing," said Chief Minister Majhi.
Union Minister Ashwini Vaishnaw termed the foundation laying a "historic day" and said the state is emerging as a key hub for advanced technology and electronics manufacturing, an "IT hub", in India.
The 3DGS unit is Odisha's push to move beyond its traditional metals and minerals base and anchor high-end electronics and semiconductor manufacturing, leveraging central approvals and global investor interest to build a diversified industrial profile.
