3D Glass Solutions facility to strengthen India’s semiconductor ecosystem, says Intel CEO

Bhubaneswar, April 19: At the groundbreaking ceremony of 3D Glass Solutions in Bhubaneswar, Intel CEO Lip-Bu Tan today h...

Odisha CM to perform ground breaking ceremony for India’s First Advanced 3D Chip Packaging Unit in Bhubaneswar tomorrow

Bhubaneswar, April 18: In a landmark step towards positioning Odisha as a global hub for advanced semiconductor manufact...