Bhubaneswar, April 19: At the groundbreaking ceremony of 3D Glass Solutions in Bhubaneswar, Intel CEO Lip-Bu Tan today highlighted the significance of the project as a major step toward strengthening India’s semiconductor ecosystem and advancing global technology collaboration.

Joining the event on virtual mode, Tan expressed appreciation for the leadership of PM Narendra Modi, whose vision has positioned India as a competitive and trusted semiconductor hub. He also acknowledged Union Minister Ashwini Vaishnaw and the India Semiconductor Mission for their strategic direction and execution in driving industry growth.

Tan extended his gratitude to Odisha CM Mohan Charan Majhi and the Government of Odisha for their proactive support and partnership in enabling the project.

Emphasizing the future of the semiconductor industry, Tan noted that advanced packaging, heterogeneous integration, and substrate technologies will play a crucial role in performance and innovation. He underscored that 3D Glass Solutions is well-positioned to contribute significantly in this space.

Highlighting Odisha’s strengths, Tan pointed to its reliable infrastructure, including power, water resources, and a skilled workforce, as key enablers for advanced manufacturing.

The new facility is expected to generate high-quality employment, foster local talent, and contribute to building a resilient semiconductor ecosystem in India. Tan concluded by expressing confidence that the project will evolve into a center of excellence, strengthening global supply chains and reinforcing India’s role in the semiconductor industry.

It may be mentioned here that Intel is associated with 3D Glass Solutions for long.