Bhubaneswar, Aug 12: Odisha Chief Minister Mohan Charan Majhi on Tuesday expressed his gratitude to the Centre for approving two semiconductor manufacturing units in the state, describing the move as a catalyst for innovation, employment generation, and Odisha's growing role in the vision of Atmanirbhar Bharat.
The Union Cabinet has approved four semiconductor projects under the India Semiconductor Mission (ISM), with a total investment of ₹4,600 crore. These projects will be established in Odisha, Punjab, and Andhra Pradesh.
Taking to social media platform X, CM Majhi stated, "I sincerely express my gratitude to Hon’ble Prime Minister Narendra Modi and Union Minister Ashwini Vaishnaw for the Central Cabinet’s approval of the establishment of two semiconductor manufacturing units in Odisha."
He further noted, “The recent amendment of the Odisha Semiconductor Manufacturing and Fabless Policy—designed to boost investment viability, competitiveness, and sustainability—along with this landmark Cabinet decision, marks a significant step forward in Odisha’s industrial and technological growth. This collaborative effort will drive innovation, create jobs, and reinforce Odisha’s contribution to the national goal of Atmanirbhar Bharat.”
U.S.-based 3D Glass Solutions Inc. (3DGS) will establish a vertically integrated advanced packaging and embedded glass substrate facility in Info Valley, Bhubaneswar.
In addition, SicSem Private Limited, in partnership with the UK-based Clas-SiC Wafer Fab Ltd., will set up an integrated Silicon Carbide (SiC) compound semiconductor facility in Info Valley. This will be India’s first commercial compound semiconductor fabrication plant.
The proposed fab will produce SiC-based devices with an annual capacity of 60,000 wafers and a packaging capacity of 96 million units. These products are set to serve a range of sectors including defence, electric vehicles, railways, fast charging systems, data centers, consumer appliances, and solar power inverters.
