Seoul, Oct 26:Samsung Electronics’ upcoming Exynos 2700 mobile processor has outperformed Qualcomm’s flagship chipset by nearly 20 per cent in an internal multicore CPU test, according to a report byThe Korea Herald.

The development comes ahead of the expected debut of the Exynos 2700 in Samsung’s Galaxy S27 series. The results are based on internal benchmark tests comparing the processor with Qualcomm’s Snapdragon 8 Elite Extreme Gen 6, which powers Xiaomi’s 18 Pro Max, the report said, citing industry sources.

In Geekbench 6.5 multicore CPU tests, the Exynos 2700 scored around 13,000, compared with approximately 11,000 for Qualcomm’s flagship processor. The Samsung chipset also recorded nearly 15 per cent higher scores in Geekbench 7.0 multicore tests.

The performance gap was wider when the Exynos 2700 was compared with the standard Snapdragon 8 Elite Gen 6 processor. Samsung’s chipset scored 44 per cent higher in Geekbench 6.5 multicore tests and 36 per cent higher in Geekbench 7.0 tests. The standard Snapdragon variant powers Xiaomi’s 18 Pro.

The Exynos 2700 also reportedly outperformed Qualcomm’s Extreme variant in graphics performance tests, which measure capabilities relevant to gaming and video playback. In tests simulating demanding gaming conditions using advanced graphics technologies, the Samsung chipset delivered around 20 per cent higher performance. It also recorded approximately 5 per cent higher scores in a separate test assessing basic graphics processing in high-end 3D games.

Qualcomm offers two variants of its latest flagship mobile processor — the Snapdragon 8 Elite Extreme Gen 6 and the standard Snapdragon 8 Elite Gen 6.

Samsung’s System LSI division develops the Exynos series of mobile processors, which handle key computing and graphics functions in smartphones. The previous-generation Exynos 2600 powers select Galaxy S26 models and the Galaxy Z Flip8.

According toThe Korea Herald, the Exynos 2700 is expected to be manufactured using Samsung’s second-generation 2-nanometre fabrication process, known as SF2P. The chipset is also expected to feature an upgraded heat path block, a packaging technology designed to improve heat dissipation and sustain performance.

The reported benchmark results could strengthen Samsung’s position in the flagship smartphone processor segment, although the chip’s real-world performance will need to be assessed after its commercial launch. (ANI)