3D Glass Solutions facility to strengthen India’s semiconductor ecosystem, says Intel CEO

Bhubaneswar, April 19: At the groundbreaking ceremony of 3D Glass Solutions in Bhubaneswar, Intel CEO Lip-Bu Tan today h...

Odisha breaks ground on India’s First Advanced 3D Chip Packaging Unit

Bhubaneswar, April 19: Odisha took a major leap into the global semiconductor value chain on Sunday with Chief Minister...

Union Minister Ashwini Vaishnaw calls 3DGS semiconductor plant foundation in Odisha a "historic day"

Bhubaneswar, April 19: Union Minister Ashwini Vaishnaw on Sunday termed the foundation laying of a semiconductor plant i...