New Delhi/Bhubaneswar, Sept 3: Odisha has made a significant leap toward becoming a key player in India’s burgeoning semiconductor and advanced electronics sector, signing Memorandums of Understanding (MoUs) worth ₹2,655 crore at SEMICON India 2025 in New Delhi.
Chief Minister Mohan Charan Majhi, who inaugurated the Odisha Pavilion at the global event, announced the major investment deals on social media, underlining the state’s vision to emerge as India’s next semiconductor powerhouse.
“Odisha showcased its vision to emerge as India’s next powerhouse in semiconductors and advanced electronics at #SEMICONIndia2025, New Delhi,” the Chief Minister posted on X.
“We signed MoUs worth ₹2,655 crore with TopTrack Hi-Tech PCB Pvt. Ltd. (₹1,005 crore) and @SancodeTech in technological partnership with Silicon Connect, Inari Amertron Berhad & APIRC Penang (₹1,650 crore), while engaging with global majors like Intel, Micron, Western Digital, Renesas, and Siemens,” he added.
The two MoUs include:
These agreements are expected to bring cutting-edge technology, generate employment, and establish Odisha as a global destination for electronics manufacturing and innovation.
The Chief Minister emphasized Odisha's commitment to the sector through landmark initiatives such as the Odisha Semiconductor Manufacturing & Fabless Policy 2025 and the Electronics Component Manufacturing (ECM) Policy 2025.
“These engagements mark a decisive step in positioning Odisha as a preferred global destination for the semiconductor and advanced electronics industry,” Majhi stated.
He also highlighted Odisha’s alignment with the India Semiconductor Mission (ISM), aimed at establishing India as a global hub for chip design and manufacturing.
At the event, the Odisha delegation also held strategic discussions with global tech leaders including Intel, Micron, Western Digital, Renesas, and Siemens, further reinforcing the state’s intent to attract major industry players and co-develop a robust, innovation-led semiconductor ecosystem.
